Modelling and thermal analysis of advanced insulating layer electronic applications
Klarmann, Steffen, Vagapov, Yuriy and Gotzig, Heinrich (2018) Modelling and thermal analysis of advanced insulating layer electronic applications. In: 24th International Workshop on Thermal Investigations of ICs and Systems THERMINIC-2018, 26-28 September 2018, Stockholm, Sweden.
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Abstract
This paper proposes the replacement of a conventional Insulating-Metal-Substrate (IMS) dielectric layer with an electroconductive adhesive which is applied onto a treated aluminium heat sink. The adhesive based structure results in a lower thermal resistance of the system compared to IMS based on Aluminium. The model covers the investigation of two IMS structure with a Copper conductor layer with a thickness of 200μm, a dielectric layer of 50μm with different thermal conductivities and an Aluminium base layer with a thickness of 920μm. However, the IMS is placed onto a 100 x 100 x 33 mm Aluminium heat sink. The investigated adhesive based structure consists of the same Aluminium heat sink treated with an oxidation layer with a thickness of 50μm and an adhesive conductor layer with 30μm thickness. Furthermore, the use of forced convection to reduce the junction temperature of all three models is also considered.
| Item Type: | Conference or Workshop Item (Paper) |
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| Divisions: | Applied Science, Computing and Engineering |
| Depositing User: | Hayley Dennis |
| Date Deposited: | 25 Feb 2019 14:00 |
| Last Modified: | 25 Feb 2019 14:00 |
| URI: | https://wrexham.repository.guildhe.ac.uk/id/eprint/17389 |
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