Experimental performance analysis of advanced layers for electronic circuit boards
Klarmann, Steffen, Vagapov, Yuriy and Gotzig, Heinrich (2019) Experimental performance analysis of advanced layers for electronic circuit boards. In: 54th IEEE Int. Universities Power Engineering Conference UPEC-2019, 3-6 Sept 2019, Bucharest, Romania.
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Abstract
This paper provides an experimental performance analysis of advanced layers for electronic circuit boards. The base material of the advanced layers used in the experiments is Al-5052, with the dimensions of 100mm x 20mm x 1mm. As insulating material between the base and conductor, two aluminium coatings were investigated and the surface structure and thermal conductivity of the coatings were examined. Furthermore, three electroconductive adhesives were applied onto the coatings. Initially, electrical performance is investigated and electrical components were applied onto the new surface structure. Finally, the environmental tests were performed to determine the robustness of the evaluated system.
| Item Type: | Conference or Workshop Item (Paper) |
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| Keywords: | aluminium, electro conductive adhesive, coating, plasma anoxided, insulated-metal-substrate |
| Divisions: | Applied Science, Computing and Engineering |
| Depositing User: | Hayley Dennis |
| Date Deposited: | 12 Nov 2019 15:46 |
| Last Modified: | 12 Nov 2019 15:46 |
| URI: | https://wrexham.repository.guildhe.ac.uk/id/eprint/17514 |
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