Temperature gradient improvement of power semiconductor modules cooled using forced air heat sink
Sharp, Andrew, Monir, Shafiul, Vagapov, Yuriy and Day, Richard (2022) Temperature gradient improvement of power semiconductor modules cooled using forced air heat sink. In: XIV International Symposium on Industrial Electronics and Applications INDEL-2022, 9-11 Nov 2022, Banja Luka, Bosnia and Herzegovina.
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Abstract
This paper discusses the improvement of operational reliability and lifetime of power electronic modules due to the reduction of the temperature gradient in the semiconductor structures. High temperature gradient in the power electronic modules having a large area of the semiconductor structure is a more affecting issue than the junction temperature. The improvement in the temperature gradient is achieved by varying/degrading the thermal resistance along the heat sink length. A conventional cooling system for three semiconductor modules based on a forced air heat sink was modelled and analysed to derive a reduction rate of the appropriate thermal resistances. Implementation of the forced air heat sink having non-uniformed thermal resistances along the heat sink length ensures the uniform temperature distribution across the power semiconductors and, therefore, the improved thermal gradient.
| Item Type: | Conference or Workshop Item (Paper) |
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| Keywords: | Semiconductor device modeling , Analytical models , Temperature distribution , Thermal resistance , Atmospheric modeling , Thermal force , Power electronics |
| Divisions: | Applied Science, Computing and Engineering |
| Depositing User: | Hayley Dennis |
| Date Deposited: | 07 Dec 2022 10:56 |
| Last Modified: | 07 Dec 2022 10:56 |
| URI: | https://wrexham.repository.guildhe.ac.uk/id/eprint/17955 |
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