Step-Cut Modification of Air-Forced Heat Sink to Improve Temperature Gradient in Power Semiconductor Modules

Sharp, Andrew, Holzenkamp, Henning, Akinsolu, Mobayode O. and Vagapov, Yuriy (2025) Step-Cut Modification of Air-Forced Heat Sink to Improve Temperature Gradient in Power Semiconductor Modules. In: 21th IEEE East-West Design and Test Symposium EWDTS 2025, Tbilisi, Georgia, 5-8 Dec 2025, Tbilisi, Georgia.

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Abstract

The thermal performance of power electronic systems is critically influenced by the ability to maintain uniform temperatures across semiconductor devices. In serially mounted semiconductor arrangements, forced-air cooling often produces a progressive heating effect, causing downstream devices to operate at higher temperatures. This non-uniform thermal loading leads to localised hotspots, accelerated material degradation, and reduced operational reliability. This paper investigates passive geometric optimisation of an air-cooled aluminium heatsink to enhance thermal uniformity across three serially mounted IGBTs. A computational numerical model was developed in ANSYS Fluent, using steady-state simulations and validated by experimental temperature measurements from a physical test rig. The baseline model demonstrated temperature differences across the length of the heatsink of up to 7.85°C at 100W, confirming the presence of a significant temperature gradient. Geometric modifications were evaluated in the form of a step-cut recess in the heatsink fins. The optimised geometry, with recess depths of 31 mm and 14 mm, reduced the temperature difference to 0.43°C under identical operating conditions, representing over 90% improvement compared to the unmodified design. The findings demonstrate that position-specific geometric tailoring of heatsinks offers a cost-effective and manufacturable solution to improve temperature synchronisation in multi-device power systems.

Item Type:	Conference or Workshop Item (Paper)
Keywords:	power electronics, forced air cooling, temperature gradient, semiconductor reliability
Divisions:	Applied Science, Computing and Engineering
Depositing User:	Hayley Dennis
Date Deposited:	07 Jan 2026 13:21
Last Modified:	07 Jan 2026 13:21
URI:	https://wrexham.repository.guildhe.ac.uk/id/eprint/18396

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